Radiation-sensitive resin composition
AssigneeJsr Corporation
InventorsHaruo Iwasawa, Akihiro Hayashi, Tsutomu Shimokawa
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AssigneeJsr Corporation
InventorsHaruo Iwasawa, Akihiro Hayashi, Tsutomu Shimokawa
Estimating the term…
A radiation-sensitive resin composition comprising (A) an acid-dissociable group-containing polysiloxane and (B) a photoacid generator containing trifluoromethane sulfonic acid or a compound which generates an acid of the following formula (I), wherein Rf individually represents a fluorine atom or a trifluoromethyl group, and Ra represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1-20 carbon atoms, or a linear or branched fluoroalkyl group having 1-20 carbon atoms, a substituted or unsubstituted monovalent cyclic hydrocarbon group having 3-20 carbon atoms, or a substituted or unsubstituted monovalent cyclic fluoro-hydrocarbon group having 3-20 carbon atoms. The radiation-sensitive resin composition of the present invention exhibits superior resolution, while maintaining high transparency to radiations and high dry etching resistance. The resin composition thus can greatly contribute to the lithography process that will become more and more minute in the future.
A radiation sensitive resin composition comprising (A) an acid-dissociable group-containing polysiloxane and (B) a compound which generates an acid of the following formula (I),
Dependencies are inferred from the claim text.