Auxiliary cooling methods and systems for electrical device housings
AssigneeADC DSL Systems, Inc.
InventorRichard J. Drapeau
Life of this patent
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Abstract
Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.
Claims31
An electronics device enclosure system, the system comprising:
- a housing, wherein the housing encloses one or more electronic devices;
- a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane;
- and
- an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing;
- and
- wherein the backplane is adapted to couple with telecommunication circuit repeater cards.
An auxiliary cooling system for a housing enclosing one or more electronic devices, the system comprising:
- a card adapted to couple with a backplane situated within the housing, wherein at least one of the one or more electronic devices are coupled to the backplane;
- and
- one or both of a thermoelectric cooling module and a fan, wherein one or both of the thermoelectric cooling module and the fan are adapted to receive electrical power from one or more power sources;
- wherein one or both of the thermoelectric cooling module and the fan are adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing;
- and
- wherein the one or more electronic devices comprise one or more telecommunication circuit repeater cards.
A method to provide auxiliary cooling to a housing enclosing one or more electronic devices, the method comprising:
- receiving power from one or more power sources with an auxiliary cooling system within a housing, wherein the housing encloses one or more electronic devices, and wherein the auxiliary cooling system comprises one or both of a fan and a thermoelectric cooling module;
- and
- operating one or both of the fan and the thermoelectric cooling module to transfer heat away from the one or more electronic devices;
- and
- wherein the auxiliary cooling system includes circuitry that mimics a remote repeater, and wherein the circuitry provides for one or more of:
- supporting embedded operations channels (EOC) for maintenance and provisioning purposes;
- supporting a definition of a unique address for the auxiliary cooling system such that the messages on an end-to-end EOC are distinguished between one or more repeaters and the auxiliary cooling system;
- passing a loop power to one or both of a repeater housed in a separate housing and an auxiliary cooling system housed in the separate housing;
- a DC continuity indication for shorts;
- shutting off power when a non-compatible component is recognized;
- supporting a capability to disable loop power enabling when a fault is detected by the auxiliary cooling system and re-enabling loop power enabling when the fault is cleared;
- and
- supporting a tone-through feature to allow tracing through the auxiliary cooling system when the auxiliary cooling system is not powered.
Dependencies are inferred from the claim text.