Hot melt adhesive composition based on a random copolymer of isotactic polypropylene and a secondary polymer

A hot melt adhesive composition comprising a blend of the following components:

• (a) about 4% to 50% by weight of a random RCP copolymer of propylene and at least one α-olefin comonomer having the following molecular structure:
• R—CH═CH2
• where R is hydrogen or a C2 to C10 alkyl group, and said α-olefin comprises about 1.5% by weight to about 20% by weight of the said RCP copolymer wherein said RCP copolymer has a density of about 0.88 g/cc to 0.905 g/cc and a melt flow rate of about 5 g/10 min to about 200 g/10 min and a melting point equal to or less than 145° C.;
• (b) about 20% to 65% by weight of a tackifier;
• (c) about 5% to 60% by weight of an atactic poly-α-olefin (APAO) polymer;
• (d) about 0% to 40% by weight of a plasticizer;
• (e) about 0% to 40% by weight of a wax;
• (f) about 0% to 3% by weight of a stabilizer;
• (g) about 0% to 60% by weight of a filler;
• and
• (h) about 2% to 40% by weight of a secondary polymer in addition to said RCP copolymer, said APAO polymer and said tackifier;
• the components totaling 100% by weight of the composition.