Vertical interconnect for organic electronic devices

A device comprising:

• a plurality of organic electronic devices disposed on a substrate, wherein each of the organic electronic devices comprises a first electrode and a second electrode;
• an organic layer disposed between the first and second electrodes of each of the plurality of organic electronic devices;
• and
• an interconnect element, wherein the interconnect element comprises an interconnect layer, and wherein the interconnect layer comprises a non-conductive matrix having conductive fillers disposed therethrough, and wherein the conductive fillers protruding out of the non-conductive matrix are configured to electrically couple a first electrode of a first organic electronic device and a first electrode of a second organic electronic device disposed adjacent to the first organic electronic device.

A device comprising:

• a plurality of organic electronic devices disposed on a substrate, wherein each of the organic electronic devices comprises a first electrode and a second electrode;
• an organic layer disposed between the first and second electrodes of each of the plurality of organic electronic devices;
• a first interconnect element disposed on the organic layer, wherein the first interconnect element is configured to provide series electrical coupling between first and second electrodes of first and second organic electronic devices disposed adjacent to each other;
• and
• a second interconnect element disposed on the organic layer, wherein the second interconnect element is configured to provide parallel electrical coupling between the first and second electrodes of the first and second organic electronic devices disposed adjacent to each other;
• wherein each of the first and second interconnect elements comprises a respective interconnect layer, and wherein each of the interconnect layers comprises a non-conductive matrix having respective conductive fillers disposed therethrough, and wherein the conductive fillers protrude out of the non-conductive matrix.

An interconnect structure comprising:

• a first conductive layer;
• an organic layer disposed on the first conductive layer;
• one or more interconnecting elements disposed through the organic layer, wherein each of the one or more interconnecting elements comprises a non-conductive material having one or more conductive elements therethrough, and wherein the conductive fillers protrude out of the non-conductive matrix;
• and
• a second conductive layer electrically coupled to the first conductive layer through at least one of the one or more conductive elements of the one or more interconnecting elements.

A method of fabricating an organic electronic device, the method comprising:

• providing a first conductive layer;
• disposing an organic material layer onto the first conductive layer;
• providing a second conductive layer;
• disposing an interconnect element on one of the first conductive layer or the organic material layer, wherein the interconnect element comprises an interconnect layer, and wherein the interconnect layer comprises a non-conductive matrix having conductive fillers disposed therethrough and wherein one or more of the conductive fillers protruding out of the non-conductive matrix extends through the organic material layer;
• and
• electrically coupling the first and second conductive layers via the interconnect element to a first or second conductive layer of an adjacent organic electronic device.