Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom
AssigneeLucent Technologies Inc.
InventorsLeonard J. Wardzala, Gregory A. Ballard, Kurt B. Friel
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Abstract
A method for fabricating thick film alumina structures used in high frequency, low loss applications is provided. More particularly, the invention is directed to a co-fire process for fabricating, or laminating, thick film structures to one another by printing a conductor layer between two thick film circuits, drying the layer, and co-firing the combined structure. This process is particularly useful in fabricating high frequency (e.g. 10 gigabit) fiber optic transmitters.
Claims18
A method for fabricating high frequency, low loss structures, the method comprising steps of:
- fabricating circuit layers on a first side of a first ceramic substrate to obtain a first circuit subassembly;
- fabricating other circuit layers on a first side of a second ceramic substrate to obtain a second circuit subassembly;
- printing a first metal layer on selected portions of a second side of the first ceramic substrate;
- drying the first metal layer;
- printing a second metal layer on selected portions of a second side of the second ceramic substrate;
- drying the second metal layer;
- printing a third metal layer on the second metal layer;
- aligning the first metal layer with the third metal layer;
- placing the first circuit subassembly on the second circuit subassembly to form a resultant assembly based on the aligning;
- drying the third metal layer;
- and,
- firing the resultant assembly, wherein the resultant assembly is a fiber optic transmitter.
A method for fabricating high frequency, low loss structures, the method comprising steps of:
- printing a first metal layer on selected portions of a first ceramic substrate;
- drying the first metal layer;
- printing a second metal layer on selected portions of a second ceramic substrate;
- drying the second metal layer;
- printing a third metal layer on the second metal layer;
- aligning the first metal layer with the third metal layer;
- placing the first ceramic substrate on the second ceramic substrate to form a resultant assembly based on the aligning;
- drying the third metal layer;
- and,
- firing the resultant assembly, wherein the resultant assembly is a fiber optic transmitter.
Dependencies are inferred from the claim text.