Heat radiation device for memory module

A heat radiation device for memory modules, intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel, said device comprising:

• heat radiation niates in pairs comnosed of a front face side heat radiation ulate in contact with the memory elements that are installed on a front face side of the substrate for each of said memory modules, and composed of a rear face side heat radiation plate in contact with memory elements that are installed on a rear face side of the substrate therefore:
• a connecting member for the heat radiation plates in pairs which connect the heat radiation plates in pairs that are installed per each of said memory modules;
• and
• a means for biasing the front face side heat radiation plates and the rear face side heat radiation plates to be attached to the memory modules so that both said radiation plates closely adhere to the memory elements.

The heat radiation device for memory modules intended for radiating heat that is generated from a memory module group wherein a plurality of memory modules equipped with memory elements on both the front and rear face sides of a substrate are placed in parallel, said device comprising:

• heat radiation plates in pairs composed of a front face side heat radiation plate in contact with the memory elements that are installed on a front face side of the substrate for each of said memory modules, and composed of a rear face side heat radiation plate in contact with memory elements that are installed on a rear face side of the substrate therefore;
• and
• a connecting member for the heat radiation plates in pairs which connect The heat radiation plates in pairs that are installed per each of said memory modules:
• wherein at least two slits are formed on the connecting member for the heat radiation plates in pairs.