System for mounting and cooling circuit boards

A computer system, comprising:

• a module comprising a circuit board;
• and
• a module support structure comprising a pair of guides, the module being coupled to the guides such that the circuit board is offset relative to the guides;
• wherein the module comprises at least one electronic component on each side of the circuit board, wherein the module is configured to reside within an envelope according to a PICMG 3.0 specification.

A computer system, comprising:

• a first module comprising a first heat producing component;
• a second module spaced from the first module, the second module comprising a second heat producing component;
• and
• a heat sink coupled to the first and second heat producing components between the first and second heat producing components;
• wherein the first and second modules are configured to mount in adjacent slots of a PICMG 3.0 compliant subrack.

A heat sink, comprising:

• a body comprising a first surface configured to couple to a first heat producing component and a second surface configured to couple to a second heat producing component;
• a first heat pipe embedded in the body, the first heat pipe being configured to transfer heat away from the first heat producing component;
• and
• a second heat pipe embedded in the body, the second heat pipe being configured to transfer heat away from the second heat producing component;
• the heat pipes comprising condenser ends, the heat pipes being arranged to diverge from one another toward the condenser ends, the heat pipes being arranged in a disconnected “Y” pattern.