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US 7,256,676 B2Granted
Printed circuit board and device including same
AssigneeArtesyn Technologies, Inc.
InventorIan Poynton
Life of this patent
Estimating the term…
Abstract
A multi-layer printed circuit board. The multi-layer printed circuit board includes a first winding, and a first via connected to the first winding. The first winding includes a first edge. The first edge defines a first footprint. The first footprint surrounds and is proximate an opening defined by the printed circuit board. At least a portion of the first via is between the first footprint and the opening.
Claims29
A multi-layer printed circuit board, comprising:
- at least first and second layers, wherein the layers define an opening therethrough;
- a first winding, wherein the first winding comprises a first winding turn on the first layer and a second winding turn on the second layer, wherein the first winding turn includes an inner edge that defines a first footprint that surrounds and is proximate the opening;
- and
- a first via connected to the first winding turn on the first layer and the second winding turn on the second layer, wherein at least a portion of the first via is located between the first footprint defined by the inner edge of the first winding turn and the opening.
1 more element
A device, comprising:
- a multi-layer printed circuit board, wherein the printed circuit board includes:
- at least first and second layers, wherein the layers define an opening therethrough;
- a first winding, wherein the first winding comprises a first winding turn on the first layer and a second winding turn on the second layer, wherein the first winding turn includes an inner edge that defines a first footprint that surrounds and is proximate the opening;
- and
- a first via connected to the first winding turn on the first layer and the second winding turn on the second layer, wherein at least a portion of the first via is located between the first footprint defined by the inner edge of the first winding turn and the opening;
- and
- a magnetic core in the opening.
4 more elements
A method of forming a device, the method comprising:
- forming at least first and second layers of a printed circuit board, wherein forming the layers includes defining an opening therethrough;
- forming a first winding, wherein forming the first winding includes forming a first winding turn on the first layer and a second winding turn on the second layer, and wherein forming the first winding turn includes forming the first winding turn to include an inner edge that defines a first footprint that surrounds and is proximate the opening;
- and
- forming a first via connected to the first winding turn on the first layer and the second winding turn on the second layer, wherein forming the first via includes forming the first via such that at least a portion of the first via is located between the first footprint defined by the inner edge of the first winding turn and the opening.
1 more element
Dependencies are inferred from the claim text.