Non-abrasive electrical test contact
OwnerTan Yin Leonginventor
Life of this patent
Estimating the term…
Abstract
A hybrid non-abrasive electrical test contact element of a test socket is taught. Unlike cantilever contact elements of the prior art, the contact element of the present invention is able to contact a lead of an integrated circuit device under test without abrading the plating on the lead. This is achieved by the contact element possessing multiple loops to allow the tip of the contact element to move not only downwards, but also sideways in a rocking and non-sliding motion. The tip of the contact is also shaped to contact the lead at only a radius corner of each lead so as not to affect the solderability of the lead. In addition, tests have shown that the contact element of the present invention has at least twice the working life span compared to another contact element of the prior art.
Claims14
A contact element of a test socket for testing an encapsulated semiconductor device having a plurality of leads, the contact element of electrically-conductive material comprising:
- a socket end;
- a contact end;
- and
- an interconnecting member connecting said socket and contact ends, said interconnecting member comprising at least one S-shaped portion, and said at least one S-shaped portion comprises two substantially 180-degree loops, which reverse in direction with respect to the axis of motion of the plurality of leads as the encapsulated semiconductor device is inserted into the test socket;
- wherein each of the plurality of the leads is bent and the contact element contacts a bent lead of said encapsulated semiconductor device at a radiused corner surface such that the interconnecting member is resilient and provides a rolling or non-sliding contact between said contact end and said radiused corner surface.
A method of maintaining the plating on an electrical lead of an encapsulated integrated circuit device during testing, the method comprising:
- contacting the lead at a radiused corner surfaced with a contact element such that the contact between said lead and a contact end of said contact element is rolling or non sliding;
- wherein:
- the lead is bent to form the rediused corner surface;
- the contact element comprises a socket end, said contact end and an interconnecting member connecting said socket and contact ends, with said interconnecting member comprising at least one S-shaped portion having two substantially 180-degree loops, which reverse in direction with respect to the axis of motion of the plurality of leads as the encapsulated semiconductor device is inserted into the test socket;
- and
- the socket end is mountable in a test socket.
Dependencies are inferred from the claim text.