Test sockets, test systems, and methods for testing microfeature devices

A test socket for receiving a microfeature device having a substrate and a plurality of interconnect elements projecting from the substrate, the test socket comprising a recess having a lead-in surface and a support surface, the support surface including a plurality of apertures positioned to receive corresponding interconnect elements of the microfeature device, wherein the individual apertures extend through the test socket and have a cross-sectional dimension less than a cross-sectional dimension of the interconnect elements so that the substrate is spaced apart from the support surface when the micro feature device is received in the recess, wherein the test socket further comprises an exterior surface opposite the support surface, and wherein the individual apertures comprise a first beveled portion proximate to the support surface and a second beveled portion proximate to the exterior surface.

A test socket for receiving a microfeature device having a substrate and a plurality of interconnect elements projecting from the substrate, the test socket comprising a support surface and a plurality of open apertures in the support surface configured to receive corresponding interconnect elements of the microfeature device, wherein individual open apertures extend through the test socket and are configured to receive only a distal portion of a corresponding interconnect element so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket, and wherein at least a section of the support surface positioned to contact at least one of the interconnect elements is dielectric.

A test socket for receiving a microfeature device having a substrate and a plurality of solder balls on the substrate, the test socket comprising:

• a body including a recess, a lead-in surface partially defining the recess, and a shelf in the recess;
• and
• a ball support member carried by the shelf, the ball support member including a plurality of open apertures positioned to receive corresponding solder balls of the microfeature device, wherein individual open apertures extend through the ball support member and are sized to receive a portion of a corresponding solder ball so that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket.

A test socket for receiving a microfeature device having a substrate and an array of conductive balls on the substrate, the test socket comprising a support surface and a plurality of open apertures arranged in an array corresponding to the array of conductive balls of the microfeature device, wherein the individual open apertures extend through the test socket and have a first diameter at the support surface and a second diameter spaced apart from the support surface, wherein the second diameter is less than the first diameter such that the substrate is spaced apart from the support surface when the microfeature device is received in the test socket, wherein at least one of the first and second diameters is less than a diameter of the conductive balls, and wherein at least a section of the support surface positioned to contact at least one of the interconnect elements is dielectric.