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US 7,256,504 B2Granted
Circuit support for a semiconductor chip and component
AssigneeSiemens Aktiengesellschaft
InventorsSilvia Gohlke, Thomas Münch
Life of this patent
Estimating the term…
Abstract
A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.
Claims15
A circuit support for a semiconductor chip having lateral edges with a given length, the circuit support comprising:
- a substrate formed of an insulating material;
- a chip mounting area on said substrate, said chip mounting area having a central area for mounting the semiconductor chip thereon, and a peripheral area surrounding said central area and defining a boundary of said chip mounting area with edges of said chip mounting area, said boundary being defined by a plurality of geometrically-shape peripheral structure elements;
- a plurality of bonding pads surrounding said chip mounting area;
- wherein, relative to the given length of the lateral edges of the chip to be mounted on said central area, said boundary of said chip mounting area has a length enabling a formation of adhesive forces preventing a bonding agent from flowing over said edges of said chip mounting area towards said bonding pads.
1 more element
Dependencies are inferred from the claim text.