Semiconductor device having adhesion increasing film to prevent peeling

A semiconductor device comprising:

• a base member;
• at least one semiconductor constructing body which is provided on one side of the base member, and which comprises a semiconductor substrate, a plurality of external connecting electrodes provided on the semiconductor substrate, and a sealing film covering circumferential surfaces of the external connecting electrodes;
• a peripheral insulating layer provided on said one side of the base member around the at least one semiconductor constructing body;
• an upper insulating layer which covers the sealing film of the at least one semiconductor constructing body and the peripheral insulating layer;
• and
• an adhesion increasing film which is formed:
• (i) between the peripheral insulating layer and sides of the at least one semiconductor constructing body, (ii) between the peripheral insulating layer and the base member around the at least one semiconductor constructing body, and (iii) between the sealing film of the at least one semiconducting body and the upper insulating layer, to prevent peeling between the peripheral insulating layer and the sides of the at least one semiconductor constructing body, between the peripheral insulating layer and the base member around the at least one semiconductor constructing body, and between the sealing film of the at least one semiconductor constructing body and the upper insulating layer.