US 7,256,494 B2 · Chip package

Abstract

A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.

Claims12

Dependent claims

A chip package, comprising:

a heat spreader having a bonding surface;
a circuit substrate disposed on the bonding surface of the heat spreader and having an opening exposing a portion of the bonding surface;
a plurality of locating structures disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely, wherein the locating structures comprise a plurality of edge folds on the opposite sides of the bonding surface, and the edges of the circuit substrate corresponding to the edge folds are fully covered by the edge folds and are locked in the edge folds;
a chip disposed on the bonding surface exposed by the opening;
a plurality of wires coupled between the chip and the circuit substrate;
and
an encapsulating compound disposed on the bonding surface exposed by the opening and covering the chip, the wires and a portion of the circuit substrate.

4 more elements

Dependencies are inferred from the claim text.

Chip package

Life of this patent

Chip package

Life of this patent

Abstract

Claims12