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US 7,256,493 B2Granted
Ball grid array housing having a cooling foil
AssigneeInfineon Technologies AG
InventorGeorg Meyer-Berg
Life of this patent
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Abstract
A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.
Claims13
A method for producing a ball grid array device comprising:
- fixing a semiconductor chip on a substrate;
- contact-connecting the semiconductor chip to the substrate;
- and
- applying a cooling foil, the cooling foil covering at least partial regions of the semiconductor chip and/or partial regions of the substrate, wherein the cooling foil is applied by one of an elastically deformable pressing tool and an elastically deformable roller tool.
1 more element
Dependencies are inferred from the claim text.