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US 7,256,479 B2Granted
Method to manufacture a universal footprint for a package with exposed chip
AssigneeFairchild Semiconductor Corporation
InventorsJonathan A. Noquil, Connie Tangpuz, Romel Manatad, Stephen Martin, Rajeev Joshi, Venkat Iyer
Life of this patent
Estimating the term…
Abstract
A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.
Claims17
A semiconductor die package comprising:
- a semiconductor die having a first surface and a second surface;
- a leadframe structure, wherein the semiconductor die is coupled to the leadframe structure;
- a molding material formed around at least a portion of the die and at least a portion of the leadframe structure, and having an exterior surface, wherein the first surface of the semiconductor die is substantially flush with at least part of the exterior surface of the molding material;
- and
- a solderable layer on at least a portion of the exterior surface of the molding material,
- wherein the solderable layer is in contact with the molding material.
3 more elements
A method comprising:
- providing a semiconductor die having a first surface and a second surface;
- attaching the semiconductor die to a leadframe structure, wherein the semiconductor die is coupled to the leadframe structure;
- forming a molding material around at least a portion of the die and at least a portion of the leadframe structure, wherein the formed molding material includes an exterior surface, and wherein the first surface of the semiconductor die is substantially flush with at least part of the exterior surface of the molding material;
- forming a solderable layer on at least a portion of the exterior surface of the molding material;
- and
- depositing solder on the solderable layer, and wherein the solderable layer is in contact with the molding material.
3 more elements
Dependencies are inferred from the claim text.