Solid-state image pickup device
AssigneeSony Corporation
InventorHideo Kanbe
Life of this patent
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AssigneeSony Corporation
InventorHideo Kanbe
Estimating the term…
A solid-state image pickup device 10 has an arrangement in which a second conductivity type semiconductor region 14 is formed on the surface of a first conductivity type electric charge accumulation region 13 of a light-receiving sensor portion, a shallow trench isolation layer 20 formed of an insulating layer is buried into a trench formed on a semiconductor substrate 11, the shallow trench isolation layer 20 is composed of an upper wide portion 21 and a lower narrow portion 22 and a second conductivity type semiconductor region 23 is formed around the lower narrow portion 22 of the shallow trench isolation layer 20. The solid-state image pickup device can suppress the occurrence of a dark current and a white spot, it can produce an image with high image quality and it can sufficiently maintain a sufficiently large amount of electric charges that can be handled by the light-receiving sensor portion.
A solid-state image pickup device comprising:
A module type solid-state image pickup device comprising:
Dependencies are inferred from the claim text.