Multilevel imprint lithography
AssigneeHewlett-Packard Development Company, L.P.
InventorsPavel Kornilovich, Yong Chen, Duncan Stewart, R. Stanley Williams, Philip J. Kuekes, Mehmet Fatih Yanik
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AssigneeHewlett-Packard Development Company, L.P.
InventorsPavel Kornilovich, Yong Chen, Duncan Stewart, R. Stanley Williams, Philip J. Kuekes, Mehmet Fatih Yanik
Estimating the term…
A mold with a protruding pattern is provided that is pressed into a thin polymer film via an imprinting process. Controlled connections between nanowires and microwires and other lithographically-made elements of electronic circuitry are provided. An imprint stamp is configured to form arrays of approximately parallel nanowires which have (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in the Y direction, and three or more distinct heights in the Z direction. The stamp thus formed can be used to connect specific individual nanowires to specific microscopic regions of microscopic wires or pads. The protruding pattern in the mold creates recesses in the thin polymer film, so the polymer layer acquires the reverse of the pattern on the mold. After the mold is removed, the film is processed such that the polymer pattern can be transferred on a metal/semiconductor pattern on the substrate.
A multiplexer/demultiplexer for nanoscale circuits comprising:
A multiplexer/demultiplexer for nanoscale circuits comprising:
An array of approximately parallel nanowires, each nanowire oriented in an X direction having (1) micro dimensions in the X direction, (2) nano dimensions and nano spacing in a Y direction, and at least two distinct heights in a Z direction, the X and Y directions parallel to a surface of a substrate underlying the array of approximately parallel nanowires, and the Z direction normal to the substrate surface, each of said nanowires, selectively making contact with portions of microscopic regions of microscopic wires or pads.
Dependencies are inferred from the claim text.