Back to results
US 7,256,431 B2Granted
Insulating substrate and semiconductor device having a thermally sprayed circuit pattern
AssigneeFuji Electric Holdings Co., Ltd.
InventorKenji Okamoto
Life of this patent
Estimating the term…
Abstract
An insulating substrate includes a metal base as a base member, an insulating layer which is a room temperature, aerosol deposited shock solidification film formed on the metal base, and a circuit pattern which is a cold sprayed thermal spray coating formed on the insulating layer. A semiconductor device incorporates the insulating substrate, and thereby has improved heat radiation characteristics.
Claims14
An insulating substrate comprising:
- a metal base;
- an insulating layer on the metal base, the insulating layer comprising a room temperature shock solidification film;
- and
- a circuit pattern on the insulating layer, the circuit pattern comprising a thermal spray coating.
1 more element
An insulating substrate comprising:
- a metal base;
- room temperature shock solidification insulating film means on the metal base;
- and
- thermal spray coating means defining a circuit pattern on the room temperature shock solidification insulating film.
1 more element
A method of forming insulating substrate comprising:
- providing a metal base;
- forming a room temperature shock solidification insulating film on the metal base;
- and
- thermal spray coating a circuit pattern on the room temperature shock solidification insulating film.
1 more element
Dependencies are inferred from the claim text.