Semiconductor device and manufacturing method thereof
AssigneeSanyo Electric Co., Ltd.
InventorsKojiro Kameyama, Akira Suzuki
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Abstract
A result of formation of an opening in a semiconductor substrate can be judged without cutting a semiconductor wafer and observing a cross-section of the cut wafer. A semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate, an opening formed in the semiconductor substrate to expose the pad electrode, a wiring layer connected with the pad electrode through the opening and a monitoring opening formed in a scribe line to monitor a result of the formation of the opening.
Claims8
A semiconductor wafer ready for separation into individual dice, the wafer comprising:
- a semiconductor substrate having a first opening;
- a metal layer disposed on a first surface of the semiconductor substrate;
- a wiring layer disposed on a second surface of the semiconductor substrate and extending into the first opening to be electrically connected with the metal layer;
- and
- a monitoring portion that is a second opening formed in the semiconductor substrate and configured to provide clear view into the second opening.
A semiconductor device comprising:
- a semiconductor substrate having a first opening;
- a metal layer disposed on a first surface of the semiconductor substrate;
- a wiring layer disposed on a second surface of the semiconductor substrate and extending into the first opening to be electrically connected with the metal layer;
- and
- a monitoring portion that is a second opening formed in the simiconductor substrate and configured to provide clear view into the second opening.
Dependencies are inferred from the claim text.