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US 7,256,356 B2Granted
Apparatus and method for coupling a module assembly in a housing
AssigneeRockwell Automation Technologies, Inc.
InventorsReinhard Schwarz, Helmut Pall
Life of this patent
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Abstract
An assembly, such as a sensor assembly, includes an optional housing having an inner surface and an outer surface where the housing includes housing connecting features. The assembly further includes a module assembly with at least one resilient member, and an elongate member coupled with the at least one resilient member. The module assembly and the elongate member are disposed within the housing where the elongate member is coupled with the housing with the housing connecting features.
Claims18
An assembly comprising:
- a module assembly including one or more electronic components;
- at least one resilient member coupled with the module assembly, the at least one resilient member is at an outer portion of the module assembly;
- at least one elongate isolation member coupled with the at least one resilient member;
- and
- a housing, the module assembly disposed within and coupled with the housing and the at least one elongate isolation member coupling the module assembly with the housing.
2 more elements
An assembly comprising:
- a housing having an inner surface and an outer surface, the housing having housing connecting features therein;
- a module assembly including at least one resilient member;
- an elongate member coupled with the at least one resilient member, the elongate member coupled with the housing with the housing connecting features;
- and
- the module assembly and the elongate member disposed within the housing.
2 more elements
An assembly comprising:
- an elongate housing;
- a module assembly including electrical components and circuitry, the module assembly disposed within the housing;
- an elongate member disposed between the module assembly and the housing, the elongate member coupled with a portion of the housing;
- and
- means for coupling the elongate member with the module assembly.
2 more elements
A method comprising:
- forming one or more resilient members adjacent to outer portions of a module assembly, the module assembly including electronic circuitry and electronic components;
- coupling an elongate member with one or more resilient members of the module assembly;
- disposing the elongate member and the module assembly within a housing;
- and
- coupling the elongate member with a portion of the housing.
2 more elements
Dependencies are inferred from the claim text.