Technique for reducing the number of layers in a multilayer circuit board

A method for reducing the number of layers in a mulilayer circuit board, the multilayer circuit board having a plurality of electrically conductive signal layers for routning electrical signals to and form at least one electronic component mounted on a surfae of the multilayer circuit board, the method comprising the steps of:

• forming a plurality of electrically conductive vias in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers;
• arranging the surface such that a set of at least two power/ground pins is electrically connected to a via that extends only partially through the multilayer circuit board so as to create at least a portion of a channel on at least a first of the plurality of electrically conductive signal layers, the portion of the channel being located substantially beneath at least one of the at least two power/ground pins;
• and
• routing at least one electrical signal path through the portion of the channel on the first of the plurality of electrically conductive signal layers.

A method for reducing the number of layers in a multilayer circuit board, the multilayer circuit board having a plurality of electrically conductive signal layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board, the method comprising the steps of:

• forming a first electrically conductive via in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers;
• forming a second electrically conductive via in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers;
• arranging the surface such that a set of at least two power/ground pins is electrically connected to the first electrically conductive via so as to create at least a portion of a first channel on at least a first of the plurality of electrically conductive signal layers and to create at least a portion of a second channel on at least a second of the plurality of electrically conductive signal layers, the portion of the first channel being located substantially beneath at least one of the at least two power/ground pins and adjacent to the first electrically conductive via, the portion of the second channel being located substantially beneath the second electrically conductive via;
• and
• routing at least one first electrical signal path through the portion of the first channel on the first of the plurality of electrically conductive signal layers and routing at least one second electrical signal path through the portion of the second channel on the second of the plurality of electrically conductive signal layers.

A multilayer circuit board, the multilayer circuit board having a plurality of electrically conductive signal layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board, the multilayer circuit board comprising:

• a first electrically conductive via formed in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers;
• a second electrically conductive via formed in the multilayer circuit board extending from the surface of the multilayer circuit board to at least one of the plurality of electrically conductive signal layers;
• wherein the surface is arranged such that a set of at least two power/ground pins is electrically connected to the first electrically conductive via so as to create at least a portion of a first channel on at least a first of the plurality of electrically conductive signal layers and to create at least a portion of a second channel on at least a second of the plurality of electrically conductive signal layers, the portion of the first channel being located substantially beneath at least one of the at least two power/ground pins and adjacent to the first electrically conductive via, the portion of the second channel being located substantially beneath the second electrically conductive via;
• at least one first electrical signal path routed through the portion of the first channel on the first of the plurality of electrically conductive signal layers;
• and
• at least one second electrical signal path routed through the portion of the second channel on the second of the plurality of electrically conductive signal layers.