Back to results
US 7,256,127 B2Granted
Air gap formation
AssigneeShipley Company, L.L.C.
InventorsMichael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
Life of this patent
Estimating the term…
Abstract
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
Claims7
A method of manufacturing a device comprising the steps of:
- a) disposing a composition comprising one or more multi-ethylenically unsaturated monomers on a device substrate;
- b) curing the one or more multi-ethylenically unsaturated monomers to form a cross-linked polymeric sacrificial material layer on the device substrate;
- c) disposing an overlayer material on the sacrificial material layer;
- and then d) removing the sacrificial material layer to form an air gap.
1 more element
Dependencies are inferred from the claim text.