Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
AssigneeTexas Instruments Incorporated
InventorJohn Paul Tellkamp
Life of this patent
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Abstract
A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, is provided. A sample structure of the structure design is evaluated to determine whether a volume of last solidification for the solder is centrally located with respect to the die pad and is located at or near an interface of the solder and the die pad. If the last solidification volume is centrally located and is located at or near the interface of the solder and the die pad, and if the die pad is delaminated from the die, the structure design is modified so that less metal of the heat sink member is centrally located than before the modifying.
Claims7
A method of reducing a likelihood that a die pad will be delaminated from a die in an integrated circuit die package for a structure design during an attachment of a heat sink member to the die pad using solder, the method comprising:
- evaluating a sample structure of the structure design to determine whether a volume of last solidification for the solder is at or near an interface of the solder and the die pad and is centrally located with respect to the die pad;
- and
- if the last solidification volume is at or near the interface of the solder and the die pad, modifying the structure design so that the last solidification volume is located farther from the interface of the solder and the die pad than before the modifying and/or is located farther from a central location of the die pad in a direction along a plane of the die pad than before the modifying.
Dependencies are inferred from the claim text.