Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts

A method for fabricating a semiconductor component comprising:

• providing a semiconductor die comprising a plurality of redistribution contacts;
• forming a plurality of interconnect contacts on the redistribution contacts having tip portions;
• forming an insulating layer on the die configured to substantially encapsulate the interconnect contacts with the tip portions exposed;
• forming a plurality of conductors on the insulating layer in electrical communication with the tip portions;
• and
• forming a plurality of terminal contacts on the insulating layer in electrical communication with the conductors.

A method for fabricating a semiconductor component comprising:

• providing a substrate comprising a plurality of semiconductor dice having a plurality of redistribution contacts in a first pattern;
• forming a plurality of interconnect contacts on the redistribution contacts having tip portions;
• forming an insulating layer on the dice and on the interconnect contacts with the tip portions exposed;
• forming a plurality of conductors on the insulating layer in physical contact with the tip portions;
• forming a plurality of terminal contacts on the insulating layer in a second pattern in electrical communication with the conductors;
• and
• singulating the dice from the substrate.