Semiconductor device and manufacturing method thereof
AssigneeSanyo Electric Co., Ltd.
InventorsTakashi Noma, Akira Suzuki, Hiroyuki Shinogi
Life of this patent
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Abstract
A stacked MCM is manufactured at reduced cost without using expensive apparatus. A first wiring and a second wiring are formed on a surface of a semiconductor chip of a first semiconductor device through an insulation film. A glass substrate having an opening to expose the second wiring is bonded to the surface of the semiconductor chip on which the first wiring and the second wiring are formed. A third wiring is disposed on a back surface and a side surface of the semiconductor chip through an insulation film and connected to the first wiring. And a conductive terminal of another semiconductor device is connected to the second wiring through the opening.
Claims9
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor wafer comprising a plurality of semiconductor chips, each of the semiconductor chips having a first wiring and a second wiring formed on an insulation film formed on a front surface of the semiconductor wafer;
- bonding a supporting flat plate only to the front surface of the semiconductor wafer;
- forming a third wiring on an additional insulation film formed on a back surface of each of the semiconductor chips so as to extend along a side surface thereof and connect to a corresponding first wiring, the back surface of the semiconductor chip corresponding to a back surface of the semiconductor wafer;
- and
- forming for each of the semiconductor chip an opening in a corresponding portion of the supporting flat plate to expose a corresponding second wiring.
Dependencies are inferred from the claim text.