LGA fixture for indium assembly process
AssigneeAdvanced Micro Devices, Inc.
InventorsSeah Sun Too, Tek Seng Tan, Keng Sang Cha, Kee Hean Keok
Life of this patent
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Abstract
An integrated circuit lid fixture and methods of using the same are provided. In one aspect, an integrated circuit lid fixture is provided that includes a base that has a plurality of pillars. Each of the plurality of pillars has a surface for supporting a substrate that may be removably seated thereon. The surfaces of the plurality of pillars have a first footprint at least as large as a footprint of the substrates to be placed thereon. A plate is provided for applying a compressive force to an integrated circuit lid positioned on any of the substrates removably seated on the pillars.
Claims18
A method of attaching a lid to a substrate, comprising:
- providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
- placing the substrate on one of the plurality of pillars, the substrate having an integrated circuit positioned thereon;
- and
- attaching the lid to the substrate.
A method of attaching a lid to a substrate, comprising:
- providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
- placing the substrate on one of the plurality of pillars, the substrate having an integrated circuit positioned thereon;
- positioning an indium film on the integrated circuit;
- attaching the lid to the substrate;
- and
- wetting the indium to both the integrated circuit and the lid by reflowing.
A method of attaching a lid to a substrate, comprising:
- providing a base having a plurality of pillars, each of the plurality of pillars having a surface for supporting a substrate removably seated thereon, the surface having a first footprint at least as large as a footprint of the substrate;
- placing the substrate on one of the plurality of pillars, the substrate having a microprocessor positioned thereon;
- positioning an indium film on the integrated circuit;
- attaching a nickel coated copper lid to the substrate;
- and
- wetting the indium to both the microprocessor and the lid by reflowing.
Dependencies are inferred from the claim text.