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US 7,256,066 B2Granted
Flip chip packaging process
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsJian-Cheng Chen, Yu-Wen Chen, Sheng-Yu Wu
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Abstract
A flip chip packaging process uses an underfill as an encapsultant to reduce the possibility of delamination from occurring due to differential coefficients of thermal expansion, and thus the reliability of a flip chip package structure can be increased. Furthermore, the flooding of the encapsulant over the cutting line need not be taken into consideration for cutting the substrate. Therefore, the usage area of the substrate usage is increased, i.e., more chips can be mounted per unit area of the substrate.
Claims4
A chip packaging process, comprising:
- providing a substrate, wherein the substrate has a stopper ring disposed around a peripheral region of the substrate;
- chip has an active surface and a back opposite to the active surface, and the active surface of the chip electrically connects to the substrate;
- dispensing an underfill in the area delimited by the stopper ring, wherein the underfill further encloses the back of the chip;
- and
- cutting the underfill and the substrate to form a chip package structure, wherein the stopper ring is also separated from die chip package structure.
2 more elements
Dependencies are inferred from the claim text.