Chemically amplified positive photosensitive resin composition
AssigneeAZ Electronic Materials USA Corp.
InventorsYoshinori Nishiwaki, Toshimichi Makii
Life of this patent
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Abstract
A photosensitive resin composition suitable for forming a thick film and an ultra-thick film used for forming a thick resist pattern used in the process of forming a magnetic pole on a magnetic head and a bump, which comprises (A) an alkali soluble novolak resin, (B) an alkali soluble acrylic resin, (C) an acetal compound, and (D) an acid generator. A polycondensate comprising a structural unit represented by the following general formula (I) (wherein R represents a saturated alkyl group having 1 to 20 carbon atoms, n is an integer of 1 to 10) as an acetal compound
Claims9
A chemically amplified positive-working photosensitive resin composition, comprising (A) an alkali soluble novolak resin, (B) an alkali soluble acrylic resin, (C) an acetal compound, and (D) an acid generator further where the weight ratio of the components (A):(B):(C):(D) is 100:(2 to 200):(1 to 50):(0.05 to 10), further where the acrylic resin contains a structural unit derived from hydroxyalkyl methacrylate and a structural unit derived from alkyl methacrylate, and optionally a structural unit derived from styrene.
Dependencies are inferred from the claim text.