Photoresist composition for imaging thick films
AssigneeAZ Electronic Materials USA Corp.
InventorsMedhat A. Toukhy, Ping-Hung Lu, Salem K. Mullen
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Abstract
The present invention provides for a light-sensitive photoresist composition useful for imaging thick films, comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a strong acid upon irradiation and a photobleachable dye. The invention further provides for a process for imaging the photoresist of the present invention, especially where the thickness of the photoresist is up to 200 microns and where the process comprises a single exposure step.
Claims17
A photoresist composition comprising a polymer which is insoluble in an aqueous alkali developer but becomes soluble prior to development, a photoacid generator which produces a strong acid upon irradiation and a photobleachable dye which is absorbing at the same radiation as the photoacid generator, further where the photoacid generator is an imide and the photobleachable dye is a naphthoquinone diazide.
Dependencies are inferred from the claim text.