Thermosetting resin composition for high speed transmission circuit board
AssigneeLG Chem, Ltd.
InventorsHyuk-Sung Chung, Bong-Jin Jeon, Hyun-Cheol Kim, Eun-Hae Koo
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Abstract
The present invention relates to a thermosetting resin composition for a high speed transmission circuit board, more particularly to a thermosetting resin composition having superior dielectric characteristics with low dielectric constant and dissipation factor and having superior glass transition temperature, heat resistance after moisture absorption, dielectric reliability, adhesion to copper film, workability, dispersibility of inorganic filler, electric characteristics, etc., and thus being useful for a copper clad laminate for high speed signal transfer.
Claims13
A thermosetting resin composition for a high speed transmission circuit board comprising:
- a) a cyanate ester based resin having at least two cyanate groups in one molecule;
- b) a dicyclopentadiene based epoxy resin;
- c) a fumed silica;
- d) a thermoplastic resin;
- e) a cyanate ester resin curing accelerator;
- f) an epoxy resin curing accelerator;
- g) a primary phenolic compound;
- and
- h) a flame retardant.
Dependencies are inferred from the claim text.