Photonic structures, devices, and methods
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames Stasiak, David Champion, Kevin Peters, Donald J. Coulman, Tony S. Cruz-Uribe
Life of this patent
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Abstract
Photonic crystal structures are made by a method including steps of providing a substrate, depositing at least one planar layer to form a stack, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices, depositing a hard mask material, depositing an imprintable material over the hard mask material, patterning the imprintable material by imprinting an array of depressions, and directionally etching at the depressions a regular array of openings through the hard mask material and the stack.
Claims32
A method for making a photonic structure, the method comprising the steps of:
- a) providing a substrate;
- b) depositing at least one planar layer to form a stack having a top surface and a stack thickness, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices;
- c) depositing a hard mask material upon the top surface of the stack;
- d) depositing an imprintable material over the hard mask material;
- e) patterning the imprintable material by imprinting a regular array of depressions;
- f) directionally etching at the depressions a regular array of openings through the hard mask material and the stack;
- g) isotropically etching a portion of a selected material from the sublayers of the stack, while leaving a portion of the selected material un-etched to support the stack;
- and
- h) repeating a subset of steps b) through f) until a desired total thickness is reached.
A method for making a photonic structure, the method comprising the steps of:
- a) providing a substrate;
- b) depositing at least one planar layer to form a stack having a top surface and a stack thickness, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices;
- c) depositing a hard mask material upon the top surface of the stack;
- d) depositing an imprintable material over the hard mask material;
- e) patterning the imprintable material by imprinting an array of depressions;
- f) directionally etching at the depressions a regular array of openings through the hard mask material and the stack;
- and
- g) filling the openings with a substance having a refractive index differing from the refractive index of at least one of the sublayers of the stack;
- and
- h) repeating a subset of steps b) through f) until a desired total thickness is reached.
A method for making a photonic structure, the method comprising the steps of:
- a) providing a substrate;
- b) depositing at least one planar layer to form a stack having a top surface and a stack thickness, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices;
- c) depositing a hard mask material upon the top surface of the stack;
- d) depositing an imprintable material over the hard mask material;
- e) patterning the imprintable material by imprinting an array of depressions;
- f) directionally etching at the depressions a regular array of openings through the hard mask material and the stack;
- g) isotropically etching a portion of a selected material from the sublayers of the stack, while leaving a portion of the selected material un-etched to support the stack;
- and
- h) filling the openings with a substance having a refractive index differing from the refractive index of at least one of the sublayers of the stack;
- and
- i) repeating a subset of steps b) through step f) until a desired total thickness is reached.
A method for making a photonic structure, the method comprising the steps of:
- a) providing a substrate;
- b) depositing at least one planar layer to form a stack having a top surface and a stack thickness, each planar layer of the stack comprising two or more sublayers having different sublayer refractive indices;
- c) depositing a hard mask material upon the top surface of the stack;
- d) depositing an imprintable material over the hard mask material;
- e) patterning the imprintable material by imprinting an array of depressions;
- f) directionally etching at the depressions a regular array of openings through the hard mask material and the stack;
- and
- g) repeating a subset of steps b) through f) until a desired total thickness is reached.
Dependencies are inferred from the claim text.