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AssigneesLG Electronics Inc., LG Micron Ltd.
InventorsSoon Bog Kwon, Sang Hun Lee, Yang Sik Moon, Ki Pyo Hong, Yoon Kuen Cho
Estimating the term…
A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.
A method for fabricating a tape substrate, comprising the steps of:
A method for fabricating a tape substrate, comprising the steps of:
A method for fabricating a tape substrate, comprising the steps of:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
No references of this kind are recorded.
Reinforcing of the conductive pattern: finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Leadframes: comprising flexible metallic tapes
Materials: of metallic layers on leadframes
Use of materials for the substrate: flexible materials
Term ended 1 Dec 2023 (estimated)
1. Field of the Invention
The present invention relates to a tape substrate and a method for plating the tape substrate, and more particularly to a tape substrate and a fabricating method thereof, in which tin is plated on a pattern portion of the tape substrate where an electronic element is to be mounted, without formation of pores or whiskers.
2. Description of the Related Art
The above objects, and other features and advantages of the present invention will become more apparent after reading the following detailed description when taken in conjunction with the drawings, in which:
FIG. 1 is a sectional view illustrating a conventional tape substrate;
FIG. 2 is a plan view illustrating a tape substrate according to the present invention;
Now, a tape substrate and fabricating method thereof according to the present invention will be described in detail with reference to the annexed drawings.
FIG. 2 is a plan view illustrating a tape substrate according to the present invention. FIG. 3 is a sectional view illustrating the tape substrate according to the present invention.
As shown in FIGS. 2 and 3, the tape substrate includes an insulating film 60, a copper foil pattern 70 formed on the insulating film 60 at one side of the insulating film 60, and provided with a connecting area where an electronic element is to be mounted, a barrier layer 75 plated on the copper foil pattern 70 at the connecting area, and formed with a plurality of pores 73, and a tin layer 77 plated on the barrier layer 75. In FIG. 3, the reference numeral 80 designates a solder resist.