Wet etching process

A bulk silicon etching method comprising the following steps in the order named:

• (a) providing a silicon wafer;
• (b) diffusing the wafer with dopant, whereby the diffusion creates a PN-junction at a predetermined PN-junction depth throughout the surface of the wafer;
• (c) providing a mask;
• (d) positioning the mask in overlying relation to the surface of the wafer;
• (e) patterning a layer of oxide on the surface of the wafer, whereby the pattern of the oxide layer is defined by the mask;
• (f) etching the wafer to create recesses in the wafer in the areas that are not patterned with the oxide layer, whereby the etching step is sufficient to etch away the wafer to a depth below the PN-junction depth created by the diffusion step, thereby creating recessed areas having sidewalls, the sidewalls characterized by the presence of the PN-junction above the PN-junction depth and the absence of the PN-junction below the PN-junction depth;
• (g) hydrofluoric acid etching the wafer to form porous silicon thereon, whereby the porous silicon is formed in the sidewalls of the recessed areas characterized by the absence of the PN-junction;
• and
• (h) subjecting the wafer to wet etching resulting in dissolution of the porous silicon.