Selective catalytic activation of non-conductive substrates

A method of providing a pattern of a metal on a non-conductive substrate, the method comprising the steps of:

• a) applying a catalytic ink in a solid pattern with an outline of the desired pattern on a surface of the non-conductive substrate, wherein the catalytic ink comprises:
• i) one or more solvents;
• ii) a source of catalytic metal ions;
• iii) a polyisocyanate crosslinking agent;
• iv) a copolymer, wherein the copolymer is capable of crosslinking with the polyisocyanate;
• and
• v) a polyurethane polymer;
• b) reducing the source of catalytic metal ions to its associated metal with a suitable reducing agent;
• c) depositing electroless metal on the pattern of catalytic ink on the surface of the substrate;
• d) plating electrolytic metal on the electroless metal layer to a desired thickness to produce the desired pattern of metal on the non-conductive substrate
• e) printing a UV etch resist with the desired pattern;
• and
• f) etching away the plated metal between the resist to define the desired circuit.

A method of providing a desired pattern of metal on a non-conductive substrate comprising the steps of:

• a) applying a catalytic ink on a surface of the non-conductive substrate, wherein the catalytic ink comprises:
• i) a solvent;
• ii) a source of catalytic metal ions;
• iii) a crosslinking agent;
• iv) a copolymer;
• and
• v) a polyurethane polymer,
• b) reducing the source of catalytic metal ions to its associated metal using a suitable reducing agent;
• c) printing resist in a desired pattern on the catalytic ink on the non-conductive substrate;
• d) depositing electroless metal on the non-conductive substrate in the areas not covered by the printed resist on the catalytic Ink;
• and
• e) plating electrolytic metal on top of the electroless metal deposit.