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US 7,255,637 B2Granted
Carrier head vibration damping
AssigneeApplied Materials, Inc.
InventorsDoyle E. Bennett, Andrew J. Nagengast, Hung Chih Chen
Life of this patent
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Abstract
A carrier head for chemical mechanical polishing that has a base having at least a portion formed of a polymer, a mounting assembly connected to the base having a surface for contacting a substrate, a retainer secured to the portion of the base to prevent the substrate from moving along the surface, and a dampening material secured between the retainer and the base.
Claims9
A carrier head for chemical mechanical polishing, comprising:
- a base having at least a portion formed of a polymer;
- a mounting assembly connected to the base having a surface for contacting a substrate;
- a retainer secured to the portion of the base to prevent the substrate from moving along the surface;
- and
- a damping material secured between the retainer and the portion of the base to reduce the translation of vibrational energy between the retainer and the base, wherein the damping material does not rebound to its original shape after being deformed;
- wherein the polymer includes polyphenylenesulfide, carbon fibers and polytetrafluoroethylene.
3 more elements
Dependencies are inferred from the claim text.