Radial-biased polishing pad
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorGregory P. Muldowney
Life of this patent
Estimating the term…
Abstract
The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the pad has a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track with a majority of the radial micro-channels having primarily a radial orientation and an average width less than 50 μm.
Claims7
A polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate, comprising:
- a) a polishing layer having a rotational center and including an annular polishing track concentric with the rotational center and having a width, the width of the annular polishing track containing radial grooves, the radial grooves having an average cross sectional area;
- and
- b) a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track, the radial micro-channels having an average cross sectional area at a multiple of at least ten less than the average cross-sectional area of the radial grooves and a majority of the radial micro-channels having primarily a radial orientation.
A method of polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium, comprising:
- polishing with a polishing pad, the polishing pad including a polishing layer having a rotational center and including an annular polishing track concentric with the rotational center and having a width, the width of the annular polishing track containing radial grooves, the radial grooves having an average cross-sectional area;
- and a plurality of radial micro-channels in the polishing layer within the width of the annular polishing track, the radial micro-channels having an average cross-sectional area at a multiple of at least ten less than the avenge cross-sectional area of the radial grooves and a majority of the radial micro-channels having primarily a radial orientation;
- and
- conditioning the pad during polishing to introduce additional radial micro-channels.
Dependencies are inferred from the claim text.