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US 7,255,630 B2Granted
Methods of manufacturing carrier heads for polishing micro-device workpieces
AssigneeMicron Technology, Inc.
InventorJason B. Elledge
Life of this patent
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AssigneeMicron Technology, Inc.
InventorJason B. Elledge
Estimating the term…
Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpiece. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.
A method for manufacturing a carrier head for use on a polishing machine to retain a micro-device workpiece during mechanical or chemical-mechanical polishing, comprising:
A method for manufacturing a carrier head for use on a polishing machine to retain a micro-device workpiece during mechanical or chemical-mechanical polishing, comprising:
A method for manufacturing a carrier head for use on a polishing machine to retain a micro-device workpiece during mechanical or chemical-mechanical polishing, comprising:
Dependencies are inferred from the claim text.