Molded part and electronic device using the same

An electronic device comprising:

• a first resin section having a first surface and a second surface opposed to the first surface;
• a second resin section in contact with the first resin section, at the second surface of the first resin section;
• a plurality of electrical connection terminals each inserted into the first resin section, each electrical connection terminal extending from the first resin section to outside;
• a plurality of metallic contact surfaces each exposed at the first surface of the first resin section, each metallic contact surface being electrically connected to a corresponding one of the electrical connection terminals;
• an electronic component electrically connected from the plurality of metallic contact surfaces;
• and
• a circuit board with the electronic component disposed thereon;
• wherein the first resin section comprises a stress-absorbing structure.

A method of manufacturing a molded part, comprising the steps of:

• forming a first resin section incorporating at least one metallic electrical contact section, the first resin section having a first surface and a second surface opposed to the first surface, wherein
• the at least one metallic electrical contact section is exposed at the first surface of the first resin section, and
• the first resin section includes a stress-absorbing structure;
• and
• forming a second resin section in contact with the first resin section at the second surface of the first resin section.