Temperature dependent semiconductor module connectors
AssigneeInternational Business Machines Corporation
InventorsWilliam L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko, James R. Wilcox
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Abstract
A method and structure is disclosed for forming a removable interconnect for semiconductor packages, where the connector is adapted to repeatedly change from a first shape into a second shape upon being subjected to a temperature change and to repeatedly return to the first shape when not being subjected to the temperature change. The connector can be disconnected when the connector is in its second shape and the connector cannot be disconnected when the connector is in its first shape.
Claims19
An interconnection between substrates, said interconnection comprising:
- a connector attached to a first substrate;
- and
- an opening in a second substrate, wherein said connector is adapted to attach to said opening,
- wherein said connector is adapted to repeatedly change from a larger size into a smaller size upon being subjected to a temperature change and to repeatedly return to said larger size when not being subjected to said temperature change, and
- wherein said connector can be disconnected from said opening when said connector is said smaller size and said connector cannot be disconnected from said opening when said connector is said larger size.
An interconnection between substrates, said interconnection comprising:
- a split-pin shaped connector attached to a first substrate;
- and
- an opening in a second substrate, wherein said connector is adapted to attach to said opening,
- wherein said connector is adapted to repeatedly change from a trapezoidal shape having a larger size into a rectangular shape having a smaller size upon being subjected to a temperature change and to repeatedly return to said larger size when not being subjected to said temperature change, and
- wherein said connector can be disconnected from said opening when said connector is said smaller size and said connector cannot be disconnected from said opening when said connector is said larger size.
An interconnection between substrates, said interconnection comprising:
- a connector;
- a first substrate having a first opening, wherein said connector is adapted to attach to said first opening;
- and
- a second substrate having a second opening, wherein said connector is adapted to attach to said second opening,
- wherein said connector is adapted to repeatedly change from a larger size into a smaller size upon being subjected to a temperature change and to repeatedly return to said larger size when not being subjected to said temperature change, and
- wherein said connector can be disconnected from said first opening and said second opening when said connector is said smaller size and said connector cannot be disconnected from said first opening or said second opening when said connector is said larger size.
Dependencies are inferred from the claim text.