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US 7,255,425 B2Granted
Ink-channel wafer integrated with CMOS wafer for inkjet printhead and fabrication method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Mu Lai, Hua-Shu Wu, Ming-Chih Chang
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Abstract
An ink-ejection unit of an inkjet printhead integrates an ink-channel wafer onto a CMOS wafer with a heating element fabricated therein. A nozzle film with a nozzle orifice is formed on the backside of the CMOS wafer, which allows two-dimensional ink ejecting from the backside of the CMOS wafer.
Claims21
An ink-ejection unit of an inkjet printhead, comprising:
- a first substrate comprising a first side and a second side opposite to said first side;
- a MOS integrated circuit and a heating element formed overlying said first side of said first substrate;
- a nozzle film with a nozzle orifice formed overlying said second side of said first substrate;
- and
- a second substrate with a trench bonded to said first side of said first substrate, wherein said trench is in a space surrounded by a bonding area between said first substrate and said second substrate to function as an ink channel structure,
- wherein said first substrate comprises at least one dielectric layer overlying said first side, in which an ink hole passes through said at least one dielectric layer and said first substrate.
3 more elements
A printhead assembly comprising a plurality of ink-ejection units, and each of said plurality of ink-ejection units comprising:
- a dual-wafer bonding substrate with a trench, wherein said trench is in a space surrounded by a bonding area between a first silicon wafer and a second silicon wafer to serve as an ink channel structure;
- a nozzle film with a nozzle orifice formed overlying an exterior surface of said dual-wafer bonding substrate;
- and
- an adhesion layer on said bonding area between said first silicon wafer and said second silicon wafer.
1 more element
A printing system, comprising:
- a printhead assembly with a plurality of ink-ejection units;
- and a controller linked to said printhead assembly;wherein, each of said plurality of ink-ejection units comprises:
- a semiconductor substrate comprising a MOS integrated circuit, a heating element and a nozzle film with a nozzle orifice;
- and
- a silicon wafer bonded to said semiconductor substrate, wherein a trench is in a space surrounded by a bonding area between said semiconductor substrate and said silicon wafer,
- wherein said semiconductor substrate comprises at least one dielectric layer overlying said first side, in which an ink hole passes through said at least one dielectric layer and said semiconductor substrate.
3 more elements
Dependencies are inferred from the claim text.