Integrated circuitry and method for manufacturing the same
AssigneeInfineon Technologies AG
InventorUdo Ausserlechner
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Abstract
The integrated circuitry on a semiconductor substrate includes an integrated circuit arranged in a circuit area of the semiconductor substrate and a stress-sensitive structure on the semiconductor substrate for detecting a mechanical stress component in the semiconductor substrate, wherein the stress-sensitive structure is implemented to provide an output signal depending on the mechanical stress component in response to an excitation and to a mechanical stress component, wherein the stress-sensitive structure is arranged in a sensor area of the semiconductor substrate and wherein the circuit area and the sensor area are spatially separated.
Claims13
An integrated circuitry on a semiconductor substrate, comprising:
- an integrated circuit arranged in a circuit area of the semiconductor substrate,
- a stress-sensitive structure on the semiconductor substrate for detecting a mechanical stress component in the semiconductor substrate,
- wherein the stress-sensitive structure is implemented to provide an output signal which depends on the mechanical stress component in response to an electrical excitation and to a mechanical stress component, wherein the stress-sensitive structure is arranged in a sensor area of the semiconductor substrate, and
- an output means for externally providing a function judging signal based on the output signal which depends on the mechanical stress component, the function judging signal comprising information with which the influence of the mechanical stress component in the semiconductor substrate on the functioning of the circuit integrated in the semiconductor substrate may be judged.
An integrated circuitry on a semiconductor substrate, comprising:
- an integrated circuit arranged in a circuit area of the semiconductor substrate,
- a stress-sensitive structure on the semiconductor substrate for detecting a mechanical stress component in the semiconductor substrate,
- wherein the stress-sensitive structure is implemented to provide an output signal which depends on the mechanical stress component in response to an electrical excitation and to a mechanical stress component, wherein the stress-sensitive structure is arranged in a sensor area of the semiconductor substrate and an output means for externally providing a function judging signal based on the output signal which depends on the mechanical stress component, the function judging signal comprising information with which the influence of the mechanical stress component in the semiconductor substrate on the functioning of the circuit integrated in the semiconductor substrate may be judged, and
- wherein the integrated circuit is implemented to be operable in a test operation mode and a normal operation mode, to provide the output signal or the processed output signal during the test operation mode.
Dependencies are inferred from the claim text.