Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
AssigneeInfineon Technologies AG
InventorsGünter Schmid, Hagen Klauk, Marcus Halik
Life of this patent
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Abstract
A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.
Claims10
A method for manufacturing a packaging material in the form of a laminate, the method comprising:
- placing a mask onto a packaging film;
- depositing aluminum onto the packaging film by vapor deposition;
- removing the mask with excess aluminum, causing only a desired antenna structure to remain on a section of the packaging film;
- bonding a microchip adhesively to the packaging film;
- and
- conductively connecting the microchip to an end of the antenna structure.
Dependencies are inferred from the claim text.