Sealing method for through hole formed in metal housing

A method of sealing a metal housing member that is a part of a housing which forms a closed space therein and includes an electric component housed therein, a lead wire connecting from the electric component to an electrode formed on an lower surface of the metal housing member in an open space, and a circuit board that is mounted on the lower surface of the metal housing member;

• the method comprising the steps of:
• preparing the metal housing member provided with a housing through hole formed on the metal housing member and penetrating from the closed space to the open space, a resin coating layer formed to cover the lower surface of the metal housing member, and a metal surface exposed part formed on a part of the resin coating layer;
• mounting the circuit board having a board aperture on the metal surface exposed part via an adhesive layer while overlapping the board aperture on the housing through hole;
• inserting the lead wire of the electric component into the housing through hole and the board aperture that are overlapped each other;
• and
• providing the sealing material on the circuit board to cover the board aperture.