Submount, pedestal, and bond wire assembly for a transistor outline package with reduced bond wire inductance

An optoelectronic assembly comprising:

• a laser pedestal having a top, a bottom, and one or more partially concentric sides;
• a laser submount adjacent to the top of the laser pedestal and having a plurality of edges, the edges of the laser submount overhanging and extending beyond the top of the laser pedestal, the laser submount for mounting a laser diode thereupon;
• a plurality of data signal contacts, the data signal contacts extending proximate the one or more partially concentric sides of the laser pedestal, the data signal contacts operating as a coaxial cable with respect to the partially concentric sides of the laser pedestal;
• wherein the laser submount is closer to the data signal contacts than are the partially concentric sides of the laser pedestal, because the submount overhangs and extends beyond the pedestal;
• a plurality of short bond wires, the bond wires connecting the plurality of data signal contacts to portions of the laser submount that overhang and extend beyond the pedestal, thereby reducing inductive effects in a transmission system including the data signal contacts, the laser submount, the short bond wires, and a laser diode.