Circuit substrate unit and electronic equipment
AssigneeSony Computer Entertainment Inc.
InventorsChiyoshi Sasaki, Kouji Hirata, Katsushi Itoh, Yasuhiro Ootori, Ryouichi Kubota
Life of this patent
Estimating the term…
Abstract
Provided is a structure in which a shield 308 and a heat sink 307 integrated with a radiation fin 306 are sandwiched by a main substrate 381a and a power source substrate 381b. A hood 142d covers the radiation fin 306 so as to collect air for cooling. Major parts of the main substrate 381a are in contact with the heat sink 307 via heat conduction members having different heat conductivity so that an even thermal distribution is provided. Thus, parts of electronic equipment can be efficiently disposed in a limited space. Moreover, the parts of the electronic equipment can be effectively cooled.
Claims22
A circuit substrate unit for mounting a circuit element, which comprises:
- a plurality of circuit substrates, each of which mounts a circuit element thereon;
- and
- at least one heat sink member;
- wherein at least one of said plurality of circuit substrates is stacked on one of the circuit substrates adjacent thereto with a space therebetween and
- said heat sink member is arranged in the space formed between said adjacent circuit substrates and
- wherein said heat sink member has a plurality of frustoconically-shaped protruding portions on at least one plane facing one of said adjacent circuit substrates which sandwich said heat sink member therebetween, and
- a circuit element arranged on a plane of the one adjacent circuit substrate facing said heat sink member and being mounted on the circuit substrate in a state where the circuit element contacts with at least one of said plurality of frustoconically-shaped protruding portions.
Electronic equipment comprising
- a circuit substrate unit having:
- a first circuit substrate;
- a second circuit substrate;
- a heat sink member;
- and
- an electronic shield member;
- a circuit element on said first circuit substrate serving as a first heat source,
- a circuit element on said second circuit substrate serving as a second heat source,
- a radiation fin on a plane of said heat sink member facing the second circuit substrate, and
- a plurality of frustoconically-shaped protruding portions on the plane of said heat sink member facing the second circuit substrate;
- wherein said first circuit substrate and said second circuit substrate sandwich said heat sink member and said electromagnetic shield member therebetween;
- and
- wherein said circuit element to serve as a second heat source contacts with said heat sink member via at least one of the plurality of frustoconically-shaped protruding portions provided on the plane facing the second circuit substrate.
A circuit substrate unit comprising:
- a first circuit substrate,
- a second circuit substrate;
- a heat sink member;
- and
- an electromagnetic shield member;
- wherein said first circuit substrate and said second circuit substrate sandwich said heat sink member and said electromagnetic shield member therebetween;
- wherein said first circuit substrate having, mounted thereon, a circuit element to serve as a first heat source and a circuit element to serve as a second heat sources;
- wherein a radiation fin and a plurality of frustoconically-shaped protruding portions are provided on a plane of said heat sink member facing the second circuit substrate;
- wherein said second circuit substrate has, mounted thereon, a circuit element to serve as a third heat source, and circuit element to serve as a third heat source contacts with said heat sink member via at least one of said plurality of frustoconically-shaped protruding portions provided on the plane facing the second circuit substrate.
Dependencies are inferred from the claim text.