Back to results
US 7,254,033 B2Granted
Method and apparatus for heat dissipation
OwnerBehdad Jafari, Inderjit Singhinventors
Life of this patent
Estimating the term…
Abstract
Embodiments of methods, apparatuses, devices, and/or systems for heat dissipation are disclosed.
Claims25
An apparatus, comprising:
- a substrate, the substrate having one or more layers;
- a first microelectronic component coupled to the substrate, wherein the microelectronic component is comprised of one or more materials, and wherein the microelectronic component has a top and a bottom surface;
- a second microelectronic component coupled to the substrate;
- a spacer coupled to the top surface of the first microelectronic component, wherein the spacer is comprised of substantially the same one or more materials as the first microelectronic component;
- and
- a heat dissipation device coupled to the spacer and the second microelectronic component wherein the spacer is configured to at least partially transfer heat from the first and the second microelectronic component to the heat dissipation device.
3 more elements
An electronic assembly, comprising:
- a substrate, wherein the substrate comprises one or more layers;
- a first and a second microelectronic component coupled to the substrate;
- a spacer coupled to the first microelectronic component, wherein the spacer has a thickness;
- a quantity of thermally conductive material formed to a thickness on at least a portion of the spacer and formed to a thickness on at least a portion of the second microelectronic component, wherein the thickness of the thermally conductive material on the second microelectronic component is greater than the thickness of the thermally conductive material on the spacer;
- and
- a heat dissipation device in thermal contact with at least a portion of spacer and the second microelectronic component, such that thermal conductivity between the heat dissipation device and the spacer is greater than between the heat dissipation device and the second microelectronic component.
3 more elements
A method of forming an electronic assembly, comprising:
- coupling a spacer to one of a plurality of microelectronic components coupled to a substrate, wherein the spacer is formed from substantially similar material as at least one of the plurality of microelectronic components;
- and
- coupling a heat dissipation device to the spacer and at least one other of the plurality of microelectronic components, such that there is a thermal conductivity between the heat dissipation device and the spacer, and between the heat dissipation device and the at least one other of the plurality of microelectronic components, wherein the thermal conductivity is greater between the heat dissipation device and the spacer than between the heat dissipation device and the at least one other of the plurality of microelectronic components.
Dependencies are inferred from the claim text.