Printed circuit board with a heat dissipation device
AssigneesFu Zhun Precision Industry (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsYong-Dong Chen, Guang Yu, Shin-Hsuu Wung, Chun-Chi Chen, Hsieh-Kun Lee
Life of this patent
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Abstract
An electronic assembly includes a printed circuit aboard, a CPU, an electronic component and a thermal pad attached to the printed circuit board. The CPU and the electronic component are located on a first face of the printed circuit board. The electronic component is located near the CPU. The thermal pad is attached to a second face opposite to the first face of the printed circuit board and located just below the electronic component.
Claims8
A printed circuit board assembly comprising:
- a printed circuit board having a top and a bottom face;
- a plurality of electronic components located on the top face of the printed circuit board;
- a plurality of thermal pads thermally attached to the bottom face of the printed circuit board and opposite to the electronic components, respectively;
- a CPU mounted on the top face of the printed circuit board, wherein the electronic components are located beside the CPU;
- and
- a plurality of heat sinks each being thermally attached to each of the thermal pads, wherein each of the thermal pads is thermally conductive and electrically insulative.
A printed circuit board assembly comprising:
- a printed circuit board having a first and a second face;
- a CPU located on the first face of the printed circuit board;
- an electronic component arranged on the first face of the printed circuit board and beside the CPU;
- a thermal pad thermally attached to the second face of the printed circuit board and opposite to the electronic component;
- and
- a heat sink thermally attached to the thermal pad;
- wherein the thermal pad is thermally conductive and electrically insulative.
An electronic assembly comprising:
- a printed circuit board having top and bottom surfaces;
- a first heat-generating electronic component being mounted on the top surface of the printed circuit board;
- at least a second heat-generating electronic component being mounted on the top surface of the printed circuit board and near the first heat-generating electronic component, wherein heat generated by the at least a second heat-generating electronic component is less than that generated by the first heat-generating electronic component;
- and
- at least a thermally conductive and electrically insulative pad being attached to the bottom surface of the printed circuit board just below the at least a second heat-generating electronic component;
- and
- a heat sink attached to the at least a pad.
Dependencies are inferred from the claim text.