Processor module for system board

A method, comprising:

• connecting a first portion of an electronic module to a printed circuit board (PCB), the first portion having a thermal dissipation device and a processor board with plural processors;
• connecting a second portion of the electronic module below the first portion so a power board in the second portion is between and parallel with the PCB and the processor board;
• providing power with the power board to the processor board;
• and
• dissipating heat away from the plural processors with the thermal dissipation device.

An electronic module connectable to a system board, the electronic module, comprising:

• a circuit board connected, in a vertical stacked configuration, to the system board and having at least one processor and memory;
• a thermal dissipation device connected to the circuit board for dissipating heat, via a heat exchange, from the processor;
• and
• a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board, wherein the power board is disposed in a space created between the circuit board and the system board.