Heat dissipation module for hinged mobile computer

An electronic device comprising:

• a base for accommodating electronic components of said electronic device therein, a ventilating portion defined on said base beside said electronic components so as to allow an interior of said base communicable with an outside of said electronic device, higher-temperature air caused by said accommodated electronic components capable of being forced to move toward said ventilating portion along a path between said ventilating portion and said electronic components in said base;
• and
• a heat dissipation module disposed in said path and spaced from said electronic components, said heat dissipation module capable of absorbing heat from said higher-temperature air passing through said path and transferring said heat out of said path.