Method and apparatus for monitoring for failure temperatures of a structure

An apparatus for monitoring a temperature of a structure, the structure including multiple structural components, comprising:

• multiple strips of tape each affixed to a corresponding one of the structural components, each tape strip carrying thereon one or more electrically conductive loops, each of the one or more electrically conductive loops including
• first and second spaced-apart elongate connection strips each extending along a length of the tape strip and each made of a first metal composition having a first melting point, and
• a temperature sensitive band connected between the first and second connection strips, the temperature sensitive band made of a second metal composition having a second melting point less than the first melting point;
• and
• a monitor, connected to the first and second connection strips of each of the electrically conductive loops, configured to detect an open-circuit in the electrically conductive loops caused when the temperature sensitive band separates from either the first or second connection strip.

A temperature sensitive tape, comprising:

• a flexible carrier having a length greater than a width thereof and being adapted to be wound into a roll;
• an electrically insulating layer overlaying a surface of the carrier;
• one or more electrically conductive loops overlaying the electrically insulating layer, the one or more electrically conductive loops including
• first and second spaced-apart elongate connection strips each extending along at least a portion of the length of the carrier, and each made of a first metal composition having a first melting point, and
• a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point.

A method of monitoring an integrity of a structure, comprising:

• affixing to the structure one or more electrically conductive loops each including
• first and second connection strips each made of a first metal composition having a first melting point, and
• a temperature sensitive band connected between the first and second connection strips and made of a second metal composition having a second melting point less than the first melting point;
• and
• monitoring for an open-circuit in the conductive loop caused when the temperature sensitive band separates from either the first or second connection strip responsive to a heating of the structure.

A method of monitoring a support member in a support structure for destructively high temperatures thereof, comprising:

• (a) determining a mechanical loading of the support member in the support structure;
• (b) determining a failure temperature of the support member based on the determined mechanical loading;
• (c) selecting a temperature monitoring apparatus including an electrically conductive loop having a temperature sensitive band thereof configured to melt at a first temperature that is equal to or below the failure temperature, and thereby cause an open-circuit in the electrically conductive loop at the failure temperature;
• (d) affixing the electrically conductive loop to the support member;
• and
• (e) monitoring the affixed electrically conductive loop for an occurrence of an open-circuit therein.